CPU and On-Chip Memory
• ESP32-D0WD-V3 or ESP32-D0WDR2-V3
embedded, Xtensa dual-core 32-bit LX6
microprocessor, up to 240 MHz
• 448 KB ROM
• 520 KB SRAM
• 16 KB SRAM in RTC
Wi-Fi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth®
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSD and SBC
Peripherals
• Up to 26 GPIOs
– 5 strapping GPIOs
• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive
touch sensor, ADC, DAC, TWAI® (compatible
with ISO 11898-1, i.e. CAN Specification 2.0)
Integrated Components on Module
• 40 MHz crystal oscillator
• 4/8/16 MB SPI flash
• ESP32-D0WDR2-V3 also provides 2 MB PSRAM
Antenna Options
• ESP32-WROOM-32E: On-board PCB antenna
• ESP32-WROOM-32UE: external antenna via a
connector
Operating Conditions
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating ambient temperature:
– 85 °C version: –40 ~ 85 °C
– 105 °C version: –40 ~ 105 °C. Note that
only the modules embedded with a 4/8
MB flash support this version.